Thermal fuses (Thermal Links) provide the most cost-effective "one-shot" or single operation over-temperature protection for small appliances, resistive heating elements, business machines and FHP motors. The "spring & pellet" design responds to temperature by interrupting an electrical circuit when the operating temperature exceeds the thermal rating of the fuse.
TCO Part Number |
Temp °C TF |
Temp °F TF |
TCO Part Number |
Temp °C TF |
Temp °F TF |
---|---|---|---|---|---|
D070 | 72 | 162 | D115 | 117 | 243 |
D076 | 77 | 171 | D118* | 121 | 250 |
D081 | 84 | 183 | D125 | 128 | 262 |
D085 | 87 | 189 | D139* | 141 | 286 |
D088 | 90 | 194 | D149 | 152 | 306 |
D090* | 93 | 199 | D165 | 169 | 336 |
D096 | 98 | 208 | D181 | 184 | 363 |
D098 | 100 | 212 | D213 | 216 | 421 |
D103 | 104 | 219 | D226* | 228 | 442 |
D108 | 109 | 228 | D242* | 240 | 464 |
DXXX Series:
Thermal cut-off with an 18 awg tin
plated copper case end lead.
DXXXA Series:
Thermal cut-off with a 23 awg case end lead.
Developed for ease of placement in windings.
DXXXC Series:
Thermal cut-off with an 18 awg steel case end lead is
available, when required.
Resistive Ratings
UL* CSA |
120VAC 16.7/25 Amps 16.7 Amps |
240VAC 16.7/25 Amps 16.7 Amps |
277VAC 15/20 Amps 15 Amps |
Internationally Approved:
Type DXXX
Approval Agency Certificate Numbers
Approval Agency | Certificate Number | Standard |
---|---|---|
UL | E49429 | UL 1020 |
CSA | LR 43279 | C22.2 NO. 209 |
BEAB | CAL0051 | IEC691/EN60691 |
VDE | DE1-4434 thru 4437 & DE1-4736 | IEC691/EN60691 |
MITI | H Series 33-735 thru 33-741 | IEC691/EN60691 |
FEMKO | 095875-01-03 | PUBL.E128(CEE 28) |
SEMKO | 7979904-01 | SEMKO 111/CEE 11 |
SEV | 737 003 | SEV 1020.1965 |
UTE | 19 479a 19 481 | NF C 73-600 |
KEMA | 86.7665 | K29A.07 |
These Thermal Links are intended for use in: tropical climates
Resistive
& Inductive circuits, have a comparative tracking index exceeding
250,
and are suitable for sealing in or use with impregnating fluids or
cleaning solvents.
Note: Consult the manufacturer when encapsulation or use
of
cleaning solvents is being considered. These operations may damage
the
TCO (Thermal Link).